Monday 23 March 2015

Electrical Engineering-2016

About Conference


The organizing committee is gearing up for an exciting and informative conference program including plenary lectures, symposia, workshops on a variety of topics, poster presentations and various programs for participants from all over the world. We invite you to join us at the Electrical Engineering 2016, where you will be sure to have a meaningful experience with scholars across the world. All members of the Electrical Engineering 2016 organizing committee look forward to meeting you in Las Vegas, USA. OMICS International organizes a conference series of 1000+ Global Events inclusive of 300+ Conferences, 500+ Upcoming and Previous Symposiums and Workshops in USA, Europe & Asia with support from 1000 more scientific societies and publishes 700+ Open access journals which contains over 30000 eminent personalities, reputed scientists as editorial board members.

Target Audience
Professors
Researchers
Scientists
Scholars
Industrials Professionals
Electronics and Electrical Engineers
Mechanical Engineers
Aeronautical Engineers
Students
Why to attend
Electronics and Electrical Engineering is the fastest growing and a leading branch of Engineering. Brilliant inventors and Researchers from the late 19th century to the present day have built on each other's work to launch a revolution in electronics. The achievements and accomplishments made in the fields of Electronics and Electrical Engineering has transformed our way of living and has become an important part of our day to day life. Electrical Engineering 2016 will discuss the latest research outcomes and technological advancements in the field, bringing together leading, researchers, scholars, professors, engineers  and students along with industrial professionals to exchange their views on critical aspects of Electronics and Electrical Engineering research. The topics of the Electrical Engineering 2016 will be based on recent advancements and future technologies in Electronics and Electrical Engineering 2016.
     Electrical Engineering 2016 brings together eminent scientists, research scholar and industrial professional which will undoubtedly enrich our meeting.
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Why Las Vegas?
 Las Vegas is the most populous city in the state of Nevada. The College of Southern Nevada is the main higher education facility in the city and it is the third largest community college in the United States by enrollment. Other institutions include the University of Nevada  , with a campus in the city, and the for-profit private school Le Cordon Bleu College of Culinary Arts. Among the main Educational opportunities in the city are the University of Nevada, Las Vegas and Nevada State College run by the Nevada System of Higher Education, Desert Research Institute.
     The city of Las Vegas is famously known as the “Entertainment capital of the World” and is known for its mega casinos –hotels and associated entertainment. The city has more AAA Five Diamond hotels than any other city in the world, and is a global leader in the hospitality industry
Latest Technologies in Electronics and Electrical Engineering
1.Electronic Nose
Electronic nose is a device which is helpful in detecting odors and flavors.Over the last decade, "electronic sensing" or "e-sensing" technologies have undergone important developments from a technical and commercial point of view. The expression "electronic sensing" refers to the capability of reproducing human senses using sensor arrays and pattern recognition systems. Since 1982, research has been conducted to develop technologies, commonly referred to as electronic noses, that could detect and recognize odors and flavors. The stages of the recognition process are similar to human olfaction and are performed for identification, comparison, quantification and other applications, including data storage and retrieval. However, hedonic evaluation is a specificity of the human nose given that it is related to subjective opinions. These devices have undergone much development and are now used to fulfill industrial needs.
2. Thermal copper pillar bump
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.
The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.
3.Digital Scent Technology
Digital scent technology (or olfactory technology) is the engineering discipline dealing with olfactory representation. It is a technology to sense, transmit and receive scent-enabled digital media (such as web pages, video games, movies and music). This sensing part of this technology works by using olfactometers and electronic noses.
4.Spintronics
Spintronics (a portmanteau meaning spin transport electronics), also known as spinelectronics or fluxtronics, is the study of the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, in solid-state devices.Spintronics differs from the older magnetoelectronics, in that spins are manipulated by both magnetic and electrical fields.
5. Flexible Electronics
Flexible electronics also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use.

Conference Highlights



  • Power Systems
  • Power Electronics
  • Electrical Machines
  • Applications of Electrical & Electronics Engineering
  • Renewable and Non-Renewable Energy Sources
  • Telecommunications
  • Signal Processing
  • Wireless Communications
  • Electronics &Electrical - Global Markets
  • Embedded Electronics Systems
  • Control Systems


Special Issues

  •  All accepted abstracts will be published in respective OMICS International Journals.
  •  Abstracts will be provided with Digital Object Identifier by Cross Ref.